PA66 Toray CM3004‑V0 Resin
PA66 Toray CM3004‑V0 Resin
Material Introduction: PA66 Toray CM3004‑V0 (Japan Toray) is a halogen‑free flame‑retardant, unreinforced injection‑molding PA66 resin. Its core advantages are outstanding halogen‑free UL94 V‑0 flame retardancy, good electrical insulation, heat resistance and mechanical strength, while retaining favorable processing flowability of PA66. Its inherent water‑absorption property will affect dimensional stability and partial performances; strict drying is mandatory before processing.
Main Applications
Electronic‑electrical industry: Parts with high requirements for flame retardancy and electrical insulation, such as electrical appliance housings, electrical components, connectors, switch bases, sockets, joints, coil bobbins, timers and circuit‑breaker covers.
Automotive industry: Automotive interior and structural components.
Other fields: Aerospace interior & structural parts, electrical components, food‑grade applications (subject to relevant certifications).
Performance Parameters
| Performance Category | Test Condition / Standard | Unit | Typical Value | Remarks & Interpretation |
|---|---|---|---|---|
| Physical Properties | ||||
| Density | ASTM D‑792 | g/cm³ | 1.18‑1.19 | Unreinforced halogen‑free flame‑retardant grade |
| Water Absorption (24hr,23℃) | ASTM D‑570 | % | 1.1 | ‑ |
| Mechanical Properties | ||||
| Tensile Strength (Yield,23℃) | ASTM D‑638 | MPa | 85 | 850 kg/cm² |
| Elongation at Break (23℃) | ‑ | % | 7.5 | ‑ |
| Flexural Strength (23℃) | ASTM D‑790 | MPa | 125 | 1250 kg/cm²; 1210 kg/cm² @‑40℃ |
| Flexural Modulus (23℃) | ASTM D‑790 | MPa | 3382 | 34500 kg/cm² @‑40℃ |
| Flexural Modulus (23℃) | ‑ | GPa | 3.5 | ‑ |
| Rockwell Hardness (R‑scale) | ‑ | ‑ | 120 | ‑ |
| Izod Un‑notched Impact Strength (23℃) | ‑ | kg·cm/cm | 5 | ‑ |
| Thermal Properties | ||||
| HDT @0.45 MPa | ASTM D‑648 | °C | 244 | ‑ |
| Melting Point | DSC | °C | 265 | ‑ |
| Electrical Properties | ||||
| Volume Resistivity | ASTM D‑257 | Ω·cm | 10¹⁵ | Typical range:10¹³‑10¹⁵ Ω·cm |
| Dielectric Strength (1/8" short‑time) | ASTM D‑149 | kV/mm | 17‑28 | ‑ |
| Dielectric Constant (50Hz,23℃) | ‑ | ‑ | 5.20 | ‑ |
| Dissipation Factor (50Hz,23℃) | ‑ | ‑ | 0.070 | ‑ |
| Arc Resistance | ASTM D‑150 | s | 127 | ‑ |
| Comparative Tracking Index (CTI) | UL 746 | V | 600 | ‑ |
| Flammability | ||||
| UL94 Rating (0.4 mm / 0.71 mm /1.5 mm /3.0 mm) | ‑ | ‑ | V‑0 | Halogen‑free flame‑retardant grade |
Injection Molding Parameters
| Processing Item | Recommended Range / Condition | Notes & Explanations |
|---|---|---|
| Drying Treatment | Hot‑air drying:80‑85 ℃ for 2‑4 h; extend drying time or adopt vacuum drying under high‑humidity environment (>50% RH); target moisture content<0.2% | Critical operation. Prevent hydrolysis‑induced bubbles, silver streaks and mechanical‑property loss. Use immediately after drying or seal and keep warm properly. |
| Barrel Temperature | Rear zone: approx.299 ℃; middle & front zone adjusted according to equipment and part geometry | Higher rear‑zone temperature improves screw retraction speed, reduces wear from unmelted particles and lowers torque load. |
| Melt Temperature | 260‑290 ℃ | Fine‑tune per equipment and part geometry. Avoid temperature>300 ℃ or long residence‑time to prevent material degradation. |
| Nozzle Temperature | 260‑277 ℃; raise temperature for cold mold to avoid nozzle freeze‑off. | ‑ |
| Mold Temperature | 80‑120 ℃ (99‑121 ℃ recommended) | Higher mold temperature delivers good surface appearance and melt filling. CM3004‑V0 solidifies rapidly and is easy for ejection even at high mold temperature. |
| Injection Pressure | Higher than unreinforced PA66 grade | Adjust according to product shape, gate and mold temperature. |
| Injection Speed | Fast injection | Fast filling avoids surface defects caused by premature solidification. |
| Back Pressure | Not recommended | Back pressure may degrade physical‑mechanical performances. |
| Screw Speed | ‑ | ‑ |
| Runner & Gate | ‑ | ‑ |
| Molding Cycle | Approx.10‑30% shorter than unreinforced PA66 | ‑ |
| Mold Release | Good, mold release agent generally unnecessary; if needed, use 0.05‑0.10% aluminum distearate. | ‑ |
Disclaimer: All above data is for reference only.



